Shenzhen Jieyang Microelectronics selects Rohde & Schwarz Ultra-Wideband (UWB) physical layer test solution

Barcelona, Spain, June 28, 2021, 2021 Mobile World Congress-Shenzhen Jieyang Microelectronics announced that it has adopted Rohde & Schwarz test solutions for UWB physical layer testing. Rohde & Schwarz has developed UWB test solutions for R&D, certification, and production, including time-of-flight (ToF) and angle of arrival (AoA) measurement and equipment calibration procedures. Among them, the R&S CMP200 wireless communication tester from Rohde & Schwarz is an ideal choice for solving UWB test challenges in production and R&D. It can integrate the functions of a signal analyzer and a signal generator on the same instrument. Combined with Rohde & Schwarz's WMT software for wireless production automation testing, and a wide range of shielded box combinations, R&S CMP200 provides IEEE 802.15 compliance for transmitters, receivers, ToF, and AoA measurements in conducted and radiated modes. Complete solution of 4a/z specification. As a mid-range vector signal generator with a frequency of up to 44 GHz, the R&S SMM100A is the only instrument of its kind that can provide a maximum 1 GHz RF modulation bandwidth, thereby meeting the requirements for wideband signal generation in UWB equipment development and production.

Shenzhen Jieyang Microelectronics is developing a complete SoC solution for UWB, including RF transceiver, baseband, integrated protocol, and integrated MCU. The radio frequency transceiver has a fully integrated receiver and transmitter, equipped with an on-chip antenna switch and power amplifier, and the transmit power exceeds 10 dBm, which can obtain a more ideal range. Since no external switch/power amplifier/balun/transformer is required, the cost and size of the BoM can be greatly reduced, which is essential for mobile phones and wearable devices/tags/digital key applications where space is usually limited. The SoC supports up to 4 antennas for 3D Angle of Arrival (AoA), which can immediately distinguish front and back angle directions. The SoC is embedded with an ARM Cortex-M CPU processor and runs software and protocols in SRAM and non-volatile memory (NVM). The SoC can be run as an independent application processor when needed, while providing multiple interfaces such as SPI, I2C, UART, and GPIO to connect with external processors or sensors. The SoC also embeds AES-128 and AES-256 as part of UWB security-ranging applications, as well as independent data security and privacy protection applications. The UWB SoC utilizes advanced 22 nm RF ULL process technology to achieve extremely low power consumption and compact size. It is an ideal choice for wearable device/tag/digital key applications.

Since the fourth quarter of 2020, Shenzhen Jieyang Microelectronics has been using Rohde & Schwarz's UWB test solutions to complete test topics defined by organizations such as IEEE and FiRa Alliance. Test cases cover BPRF (Basic Pulse Repetition Frequency) and HPRF (High pulse repetition frequency). Mr. Bill Zhang, CEO of Shenzhen Jieyang Microelectronics, said: "UWB will become a standard wireless technology that can be seen everywhere because UWB provides unprecedented reliable, safe, accurate, fast and power-saving ranging and positioning capabilities. Schwartz's UWB tester solution has provided us with great help in completing UWB conformance and interoperability testing, ensuring that our UWB chips can be adopted by various fields and suppliers in the market. UWB chips and chipsets we provide Will fully meet market demand, promote UWB market penetration, and facilitate the use." Alexander Pabst, Vice President of Rohde & Schwarz Wireless Communications Market said: "Rohde & Schwarz recognizes that safe and reliable UWB technology is powerful, I am also very happy to provide our first-class test solutions to industry participants around the world. We have worked closely with FiRa to validate the R&S CMP200 as a physical layer test platform."